Stress and Deformation Analysis at the Micro-Scale
Korsunsky, Alexander M.
9th International Conference on MicroManufacturing (ICOMM 2014)
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Improving the structural integrity of microstructured materials relies on the combination of advancements in modeling capability and spatially resolved experimental characterization of deformation and damage. We report the recent advancements in the use of synchrotron X-ray diffraction techniques, as well as in the methods utilizing micro-scale material removal in combination with scanning electron microscopy and digital image correlation for relief strain measurement and stress evaluation.
digital image correlation
focused ion beam
ICOMM 2014 No. 88