Hybridizing Micromachining and Microfabrication for Sensor Chips
8th International Conference on MicroManufacturing (ICOMM 2013)
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We present an example of packaging a MEMS sensor for measuring fluctuations of the wall shear stress in turbulent fluid flows. For these sensors, topographical and thermal constraints required the development of a hybrid technique for the packaging. This involved standard microfabrication patterning to create the chip, sub-millimetre micro-machining and firing of low thermal conductivity ceramic, combined with shadow-mask-patterned metal film sputtering as well as wire etching, to address the constraints on packaging.
turbulent wall shear stress
MEMS sensors and actuators
ICOMM 2013 No. 121