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    An analytical model for calculating the temperature distribution and determining the laser forming mechanism

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    ICOMM 2013 Paper No. 99 (790.9Kb)
    Date
    2013-03-25
    Author
    Lok, Morgan
    Aoyama, Hideki
    Publisher
    8th International Conference on MicroManufacturing (ICOMM 2013)
    Metadata
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    Abstract
    Analyzing Laser Forming is computationally expensive, both using analytical and numerical methods. This makes it impractical to quickly determine what bending mechanism will occur for certain scanning parameters without significant simulation time, or actual experimentation. To address this, a new computation method was developed to compute the analytical point-source temperature field using Quasi-Monte Carlo, which reduced the computation time from days to minutes. Using the generated temperature field and a simple spring model based on a model to predict residual stress formation in welds, it was possible to quickly determine the bending mechanism (Temperature Gradient, Coupling, or Buckling mechanism) for different scanning parameters. The simulation results agreed closely with experimentation for SUS304 samples, especially when the absorption coefficient was improved and controlled using a black coating.
    Subject
    Bending Mechanism
    Sheet Metal
    Residual Thermal
    Monte Carlo
    CM
    TGM
    Gaussian
    BM
    Temperature Distribution
    Laser Forming
    Permanent Link
    http://digital.library.wisc.edu/1793/65379
    Type
    Conference Paper
    Citation
    ICOMM 2013 No. 99
    Part of
    • International Conference on MicroManufacturing (ICOMM)

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