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    • College of Engineering, University of Wisconsin--Madison
    • Department of Electrical and Computer Engineering
    • Theses--Electrical Engineering
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    Temperature and Heat Flux Measurements in Ultrasonic Welding using Thin Film Micro Sensors

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    Hang Li ECE Project Report (3.439Mb)
    Date
    2011-05-15
    Author
    Li, Hang
    Department
    Electrical Engineering
    Advisor(s)
    Jiang, Hongrui
    Metadata
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    Abstract
    This project is to develop instrumentation and measurement of temperature and heat flux with unprecedented high spatial and temporal resolution by placing micro thermocouple and heat flux sensor arrays at the very vicinity of the weld spot in battery tab joining. The sensor arrays will be direct fabricated on the surface of the battery interconnect bus bar materials, particularly at the interconnect surface. It will also develop instrumentation by embedding the micro thermocouple and heat flux sensor arrays at the anvil for characterization of weld quality.
    Permanent Link
    http://digital.library.wisc.edu/1793/53723
    Type
    Project Report
    Part of
    • Theses--Electrical Engineering

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